semiconductor/LEDs

semiconductor/LEDs

Perfecting 24/7 Semiconductor/LED Applications

  • delivering highest reliability for dependable multi-year continuous production
  • enabling lowest cost-per-part manufacturing with unprecedented cost-performance
  • driving highest throughput with highest power, cost-effective lasers

Semiconductor and LED Processing

Spectra-Physics is a leading supplier of lasers for the manufacture of semiconductors and LEDs. Our lasers are proven in a wide range of semiconductor and LED applications including LED scribing and lift-off, silicon scribing/dicing, wafer inspection, circuit trimming/repair and many other applications. With thousands of UV lasers deployed in demanding semiconductor and LED applications, Spectra-Physics delivers a broad portfolio of highly reliable, cost-effective lasers backed by our industry-leading global support organization.

So contact our experts to discuss your laser application needs and challenges. Let’s work together to solve them.

Scribing/dicing/grooving
Silicon, sapphire, GaAs, low-k, ceramic, GaN, AlInGaN, glass, copper
Trimming
Resistor - thin film, thick film, inductors
Cutting
Die attach film (DAF)
Via drilling
Silicon interposer (TSV), glass interposer, LTCC tape, alumina/ceramic
Marking
Silicon, sapphire, ceramic, IC package, AlN, alumina
Micromachining
Silicon, glass
Memory repair
Silicon IC
Annealing
a-Si
Wafer inspection
Silicon IC
Package singulation
Mold compound
Laser lift-off
GaN, AlInGaN
Quasar
Highest power hybrid fiber laser with TimeShift pulse flexibility for high speed, quality micromachining
Talon
Disruptive cost-performance UV and green lasers
HIPPO
Versatile design for micromachining and scribing in a compact industrial package
Spirit
Setting a new standard for high-precision femtosecond machining
IceFyre
Versatile game-changing picosecond laser for precision micromachining
VGEN-ISP-POD
Exceptional functionality pulse-on-demand (POD) MOPA fiber laser
VGEN-G
Pulsed green fiber lasers (532 nm)

Lasers for Semiconductor and LED Processing

ProductTypePulse WidthPowerWavelength
new
Spirit
Setting a new standard for high-precision femtosecond machining
Ultrafast 400 fs 8 W, 16 W, 30 W,
70  W, 100 W
515, 520, 1030, 1040 nm
new
IceFyre
Versatile game-changing picosecond laser for precision micromachining
Picosecond <20 ps >50 W 1064 nm  
Quasar
Highest power hybrid fiber laser with TimeShift pulse flexibility for high speed, quality micromachining
Hybrid Fiber 2–100 ns 45–60 W, 75–95 W 355, 532 nm  
Talon
Disruptive cost-performance UV and green lasers
Q-switched 15–100 ns 6–45 W, 15–40 W 355, 532 nm  
HIPPO
Versatile design for micromachining and scribing in a compact industrial package
12–30 ns 2 W, 17–27 W 266, 1064 nm  
Explorer
DPSS IR lasers
<12 ns 2 W 1064 nm  
new
Explorer One
Compact air cooled high power UV ns laser
5-15 ns, <12 ns, <15 ns 1.1-0.5 W, 2 W, 4 W, 5 W 349, 355, 532 nm  
Navigator
Industry leading history/reliability for trimming and micromachining
8–110 ns 3–12 W 532, 1064 nm  
Vanguard
Mode-locked, Quasi-CW: reliable with proven longevity
Quasi-CW <12 ps 0.3–2.5 W 355 nm  
Quanta-Ray Pro
Pulsed Nd:YAG with up to 2.5 J of energy per pulse
Pulsed Nd:YAG 1–12 ns 15–50 W 266, 355, 532, 1064 nm  
new
VGEN-G
Pulsed green fiber lasers (532 nm)
Fiber <1 to >20 ns 10–30 W 532 nm  
VGEN-ISP-POD
Pulse-on-Demand MOPA fiber lasers
2–250 ns 20–50 W 1060–1080 nm  

Application Notes

application notesnew
Burst Machining of Copper and Stainless Steel with IceFyre® Picosecond Laser for Enhanced Material Removal Rates
application notesnew
Flexible OLED Manufacturing with High Power Femtosecond Laser
application notesnew
Picosecond Laser Burst Machining of Silicon to Enhance Material Removal Rate and Quality
application notesnew
High Speed Processing of Plastics with a 100 W Femtosecond Laser
application notesnew
Micromachining Transparent, Brittle Materials with IceFyre Picosecond Laser
application notesnew
Ceramic Scribing Using Talon Pulsed UV and Green Lasers
application notesnew
E-Track: Active Pulse Energy Control for Explorer One Lasers
application notes
Through-Glass Via Drilling with a UV Laser Source: Temporal Pulse Tailoring for Improved Throughput and Quality
application notes>
Glass Cutting with Spirit
High Quality Precision Micromachining at 50 m/sec Scanning Speed with Quasar
Glass Cutting and Si Scribing with Quasar
Ultrashort-pulse Laser Structuring with Spirit and Spirit ps
fs Laser Irradiation and Chemical Etching (FLICE)
ITO and Ag Patterning with VGEN-ISP
Explorer Fuels Laser Marking Trend Toward Shorter Wavelengths
LED Sapphire Wafer Scribing Using 355 nm Lasers
LED Laser Scribing Brochure
Glass Cutting with UV Lasers
High Speed Laser-Dicing of Thin Silicon Wafers Using Line-Focus

Technical Articles

Resource Library