q-switched lasers

349/355 nm Q-Switched Lasers Selection Guide

ProductDescriptionPowerPulse EnergyPulse Width
Quasar
Highest power hybrid fiber laser with TimeShift pulse flexibility for high speed, quality micromachining
 
 
Power
>60 W
>45 W
Pulse Energy
>300 µJ @ 200 kHz
>225 µJ @ 200 kHz
Pulse Width
TimeShift pulse flexibility,
<2 ns to >100 ns
Plus pulse shaping and Burst Mode
new
Talon
Disruptive cost-performance UV lasers
new
 
Power
>45 W
>30 W
>20 W
>15 W
>12 W
>11 W
>10 W
>6 W
Pulse Energy
>300 µJ @ 150 kHz
>300 µJ @ 100 kHz
>200 µJ @ 100 kHz
>300 µJ @ 50 kHz
>240 µJ @ 50 kHz
>275 µJ @ 40 kHz
>500 µJ @ 20 kHz
>120 µJ @ 50 kHz
Pulse Width
<40 ns
<25 ns
<25 ns
<25 ns
<25 ns
~50 ns
~40 ns
<25 ns
 
new
Explorer One
Compact air cooled high power UV ns laser
new
 
Power
>4 W
>2 W
>800 mW
>800 mW
>300 mW
>120 mW
>60 mW
Pulse Energy
>50 µJ @ 80 kHz
>25 µJ @ 80 kHz
>16 µJ @ 50 kHz
>80 µJ @ 10 kHz
>6 µJ @ 50 kHz
>120 µJ @ 1 kHz
>60 µJ @ 1 kHz
Pulse Width
<15 ns
<8 ns
<10 ns
<15 ns
<15 ns
<5 ns
<5 ns
 

532 nm Q-Switched Lasers Selection Guide

ProductDescriptionPowerPulse EnergyPulse Width
Quasar
Highest power green hybrid fiber laser with TimeShift pulse flexibility for high speed, quality micromachining
 
>95 W
>75 W
>475 µJ @ 200 kHz
>375 µJ @ 200 kHz
TimeShift pulse flexibility,
<2 ns to >100 ns
Plus pulse shaping and Burst Mode
new
Talon
Disruptive cost-performance UV lasers
new
 
Power
>40 W
>20 W
~15 W
Pulse Energy
>400 µJ @ 100 kHz
>400 µJ @ 50 kHz
~1000 µJ @ 15 kHz
Pulse Width
<25 ns
<25 ns
25-40 ns
 
VGEN-G
Pulsed green fiber lasers (532 nm)
 
Power
>30 W
>20 W
>10 W
Pulse Energy
>180 µJ
>100 µJ, >180 µJ
>100 µJ, >180 µJ
Pulse Width
3 to >50 ns
 
new
Explorer One
Compact air cooled high power UV ns laser
new
 
Power
>5 W
>2 W
>2 W
Pulse Energy
>63 µJ @ 80 kHz
>40 µJ @ 50 kHz
>200 µJ @10 kHz
Pulse Width
<12 ns
<15 ns
<15 ns
 
Navigator
Industry leading history/reliability for trimming and micromachining
 
> 9 W
>4 W
>3.5 W
>3 W
>450 µJ
>200 µJ
>300 µJ
>77 µJ
<35 ns
<15 ns
70–90 ns
25–35 ns

1064 nm Q-Switched Lasers Selection Guide

HIPPO
Versatile design for micromachining and scribing in a compact industrial package
 
>27 W
>17 W
>560 µJ
>560 µJ
<30 ns
<15 ns
 
Navigator
Industry leading history/reliability for trimming and micromachining
 
>12 W
>6.5 W
>7 W
>6 W
>5 W
>1200 µJ
>650 µJ
>350 µJ
>600 µJ
>142 µJ
<80 ns
<70 ns
70–110 ns
30–40 ns
<8.5 ns
 
Explorer
DPSS IR lasers
 
POwer
>2.5 W
Pulse Energy
>25 µJ @ 100 kHz
Pulse Widths
<12 ns
 

266 nm Q-Switched Lasers Selection Guide

ProductDescriptionPowerPulse EnergyPulse Width
HIPPO Prime
Deep UV micromachining
 
Power
>2.0 W
Pulse Energy
>40 uJ @ 50 kHz
Pulse Width
>12 ns
 

ITO laser patterning
TCO laser patterning
LDP/LDI, repairing LCD/PDP, and PDP/AM OLED processing
Inside glass laser marking and titling
Hole drilling, cutting, and machining
Black matrix patterning
Via hole laser drilling
Flex circuit laser cutting (coverlay cutting) and laser drilling
PCB laser singulation
Laser ablation of material on PCBs and PCB structuring
Electronic package laser singulation
Ceramic laser scribing
Laser drilling ceramic foils
Laser scribing and laser dicing of wafers
Low K dielectric laser scribing and laser grooving
Laser marking of wafers
Die attach film (DAF)
TSV (through silicon via) laser drilling
Electronic package singulation (micro-SD, QFN, FBGA and DCA)
Laser scribing and laser dicing of sapphire, GaAs, GaN
Laser liftoff
Memory repair
Thin film P1, P2, P3 layer laser scribing, a-Si TF laser scribing, Mo-Si TF laser scribing
Laser doping of selective emitters (LDSE), c-Si laser processing
Laser doping of emitters using PSG as doping precursor
Metal wrap through (MWT) laser drilling
Emitter wrap through (EWT) laser drilling
c-Si solar cell edge isolation, c-Si laser processing
Laser grooved buried contacts (LGBC)
Laser scribing of silicon nitride
Laser defect/shunt repair
c-Si wafer marking
c-Si solar cell laser-fired contacts (LFC)
Stereolithography (exposure/ablation)
Marking
Metals, plastics
Deep/fine engraving
Metals, polymers, ceramics, glass
MALDI mass spectrometry
Laser microdissection
Molecular uncaging
LIDAR and LADAR
Range finding
Mobile LIDAR applications